INTL
Freelancer
어려움
외주
원격 가능
Futuristic 3D-Printable Device Enclosure
예산
$30~$250 USD
예상 기간
2~4주
난이도
어려움
기술 스택
3D Rendering
Product Design
3D Modelling
3D Animation
3D Design
3D Printing
Blender
Fusion 360
SolidWorks
3D CAD
3D Graphic Design
DFAM (Design for Additive Manufacturing)
AI 분석 요약
이 프로젝트는 미래적인 세일러 문 크리스탈 브로치와 스마트폰을 결합한 휴대용 장치용 3D 프린팅 가능한 정밀 전자 인클로저를 디자인하는 것입니다. 라즈베리 파이 제로, 배터리, 스피커 등 내부 부품을 정확히 수용하고 냉각 및 조립 편의성을 고려한 기능적인 디자인 역량이 필요합니다.
프로젝트 원문 설명
I'm looking for an experienced 3D designer to create a precise, 3D-printable enclosure for a custom handheld device. This design should be inspired by a futuristic Sailor Moon crystal brooch combined with a modern smartphone. It's important to note that this is a functional electronics housing, not just a decorative prop.
Requirements:
- The design must be 3D-printable, as I plan to use PLA material.
- The ideal candidate should have a strong background in 3D design, especially with intricate and functional designs.
- Experience in creating designs based on concept sketches and photos is preferred.
Ideal Skills and Experience:
- Proficiency in 3D modeling software (e.g., Fusion 360, Blender, SolidWorks).
- Strong understanding of 3D printing processes and constraints.
- Ability to translate concept sketches and reference photos into accurate and functional 3D models.
- Attention to detail and creativity in integrating decorative elements with functional design.
Project Title: Custom Round “Smart Brooch” Device – CAD Design for 3D Printing
Project Overview:
I am looking for an experienced 3D designer to create a precise, 3D-printable enclosure for a custom handheld device inspired by a futuristic Sailor Moon crystal brooch combined with a modern smartphone. This is a functional electronics housing, not just a prop.
---
CORE DESIGN REQUIREMENTS
Overall Shape & Size
- Circular design
- Diameter: 127mm (5 inches)
- Total assembled thickness: 14–16mm
---
FRONT (TOP HOUSING)
- Large centered circular display opening: 90mm diameter
- Minimal bezel (clean, smartphone-style look)
- Internal recessed lip:
- 2mm wide
- 1–1.5mm deep
- Used to hold acrylic and screen layers
- Must support layered structure:
- Acrylic lens (1.5–2mm)
- Masking ring (thin layer under acrylic)
- Touchscreen beneath
---
SCREEN DESIGN CONSIDERATION
- Screen is rectangular but must appear circular
- Design must:
- Hide screen edges completely
- Allow precise centering under 90mm window
- No modification to screen itself
---
BUTTONS (RIGHT SIDE)
- Volume rocker cutout:
- 22.5mm x 4.5mm
- Power button cutout:
- 12.5mm x 4.5mm
- Include internal clearance (2–3mm behind buttons)
---
SCREW SYSTEM
- 4x M2 screws
- Evenly spaced (90° apart)
- Radius from center: 47mm
- Include matching internal standoffs:
- Height: 6–8mm
- Diameter: ~5mm
- Hole sized for self-tapping M2 screws
---
BOTTOM HOUSING (INTERNAL STRUCTURE)
Must include organized internal layout for:
1. Raspberry Pi Zero 2 W
- Dedicated mounting area (right side)
- 4 standoffs (M2 compatible)
- Clearance under board: 2mm minimum
2. Battery Compartment
- Left side placement
- Space: 60mm x 30mm x 6mm
- Include small retention lip or support
3. Speaker Housing
- Bottom center placement
- 30–40mm diameter recess
- 3–5mm depth
- Include front or rear sound holes
---
AIRFLOW / COOLING
- Top vents:
- 8–12 holes
- 3mm diameter
- Positioned along top arc (~120°)
- Bottom vents:
- 6–8 holes
- 3mm diameter
- Must allow airflow path across main board
---
CHARGING PORT
- USB-C cutout
- Size: ~10mm x 5mm
- Placement: top edge or accessible side
---
ASSEMBLY REQUIREMENTS
- Two-part enclosure:
- Top shell (screen housing)
- Bottom shell (component housing)
- Must:
- Align perfectly
- Be screw-fastened (no glue required)
- Allow easy disassembly for maintenance
---
PRINT REQUIREMENTS
- Optimized for FDM 3D printing
- Wall thickness: 2.5–3mm
- Include proper tolerances:
- Holes: +0.2mm
- Clearances: +0.2–0.3mm
- Avoid unnecessary supports where possible
---
FILES REQUIRED
- STL (for printing)
- STEP or F3D (for editing)
---
GOAL
Create a clean, modern, screen-dominant device that looks like a real piece of tech—not a toy. The front should resemble a smartphone surface, with all decorative elements handled digitally on-screen.
---
BONUS (OPTIONAL)
- Suggestions for improving durability or assembly
- Optional snap-fit or magnetic closure ideas
---
Please include examples of similar work (electronics enclosures, handheld devices, or compact assemblies). I am open to collaboration and revisions if needed.
Thank you!
Requirements:
- The design must be 3D-printable, as I plan to use PLA material.
- The ideal candidate should have a strong background in 3D design, especially with intricate and functional designs.
- Experience in creating designs based on concept sketches and photos is preferred.
Ideal Skills and Experience:
- Proficiency in 3D modeling software (e.g., Fusion 360, Blender, SolidWorks).
- Strong understanding of 3D printing processes and constraints.
- Ability to translate concept sketches and reference photos into accurate and functional 3D models.
- Attention to detail and creativity in integrating decorative elements with functional design.
Project Title: Custom Round “Smart Brooch” Device – CAD Design for 3D Printing
Project Overview:
I am looking for an experienced 3D designer to create a precise, 3D-printable enclosure for a custom handheld device inspired by a futuristic Sailor Moon crystal brooch combined with a modern smartphone. This is a functional electronics housing, not just a prop.
---
CORE DESIGN REQUIREMENTS
Overall Shape & Size
- Circular design
- Diameter: 127mm (5 inches)
- Total assembled thickness: 14–16mm
---
FRONT (TOP HOUSING)
- Large centered circular display opening: 90mm diameter
- Minimal bezel (clean, smartphone-style look)
- Internal recessed lip:
- 2mm wide
- 1–1.5mm deep
- Used to hold acrylic and screen layers
- Must support layered structure:
- Acrylic lens (1.5–2mm)
- Masking ring (thin layer under acrylic)
- Touchscreen beneath
---
SCREEN DESIGN CONSIDERATION
- Screen is rectangular but must appear circular
- Design must:
- Hide screen edges completely
- Allow precise centering under 90mm window
- No modification to screen itself
---
BUTTONS (RIGHT SIDE)
- Volume rocker cutout:
- 22.5mm x 4.5mm
- Power button cutout:
- 12.5mm x 4.5mm
- Include internal clearance (2–3mm behind buttons)
---
SCREW SYSTEM
- 4x M2 screws
- Evenly spaced (90° apart)
- Radius from center: 47mm
- Include matching internal standoffs:
- Height: 6–8mm
- Diameter: ~5mm
- Hole sized for self-tapping M2 screws
---
BOTTOM HOUSING (INTERNAL STRUCTURE)
Must include organized internal layout for:
1. Raspberry Pi Zero 2 W
- Dedicated mounting area (right side)
- 4 standoffs (M2 compatible)
- Clearance under board: 2mm minimum
2. Battery Compartment
- Left side placement
- Space: 60mm x 30mm x 6mm
- Include small retention lip or support
3. Speaker Housing
- Bottom center placement
- 30–40mm diameter recess
- 3–5mm depth
- Include front or rear sound holes
---
AIRFLOW / COOLING
- Top vents:
- 8–12 holes
- 3mm diameter
- Positioned along top arc (~120°)
- Bottom vents:
- 6–8 holes
- 3mm diameter
- Must allow airflow path across main board
---
CHARGING PORT
- USB-C cutout
- Size: ~10mm x 5mm
- Placement: top edge or accessible side
---
ASSEMBLY REQUIREMENTS
- Two-part enclosure:
- Top shell (screen housing)
- Bottom shell (component housing)
- Must:
- Align perfectly
- Be screw-fastened (no glue required)
- Allow easy disassembly for maintenance
---
PRINT REQUIREMENTS
- Optimized for FDM 3D printing
- Wall thickness: 2.5–3mm
- Include proper tolerances:
- Holes: +0.2mm
- Clearances: +0.2–0.3mm
- Avoid unnecessary supports where possible
---
FILES REQUIRED
- STL (for printing)
- STEP or F3D (for editing)
---
GOAL
Create a clean, modern, screen-dominant device that looks like a real piece of tech—not a toy. The front should resemble a smartphone surface, with all decorative elements handled digitally on-screen.
---
BONUS (OPTIONAL)
- Suggestions for improving durability or assembly
- Optional snap-fit or magnetic closure ideas
---
Please include examples of similar work (electronics enclosures, handheld devices, or compact assemblies). I am open to collaboration and revisions if needed.
Thank you!
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